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Rigid

PCB TECHNOLOGY
We make thousands of different PCBs for all different types of applications. Our support extends to the full range of PCB materials and strong technical capabilities. Please see our general capabilities by the product category below.
Product List
FeatureStandardAdvancedR&D
Layers count2650>50
Minimum board thickness ( with solder mask)16 mil | 0.4 mm10.2 mil | 0.26 mm (2L, ENIG)8 mil | 0.2 mm
Maximum board thickness0.2 inch | 5 mm0.31 inch | 8 mm0.47 inch | 12 mm
Minimum board size1.18 inch x 1.18 inch | 30 mm x 30 mm0.4 inch x 0.4 inch | 10 mm x 10 mm0.2 inch x 0.2 inch | 5 mm x 5 mm
Maximum board size30 inch x 22.44 inch | 762 mm x 570 mm37.8 inch x 23.6 inch | 960mm 600mm49.2 inch x 23.6 inch | 1250mm 600mm
Minimum line/space innerlayer (depend on copper weight)3 mil / 3 mil | 75 um / 75 um2.5 mil / 3 mil | 65 um / 75 um2 mil / 2 mil | 50 um / 50 um
Minimum line/space outerlayer (depend on copper weight)3.5 mil / 3.5 mil | 90 um / 90 um3 mil / 3 mil | 75 um / 75 um2 mil / 2 mil | 50 um / 50 um
Surface finish typesOSP, HASL, ENIG, Immersion Silver, Immersion TinPlus ENEPIGPlus ISIG,EPIG
Surface finish types (continued)Soft Gold, Hard gold, Selective Hard gold (Goldfingers)Plus ENEPIGPlus ISIG,EPIG
Mechanical hole size ( Finish hole size)6 mil | 0.15 mm4 mil | 0.1 mm (for 32 mil board thickness)4 mil | 0.1 mm
Maximum aspect ratio PTH10:116:1 (25:1 for the hole > 6 mil)20:1
Finished tolerance PTH+/- 3 mil | +/- 0.075 mm+/- 2 mil | +/- 0.05 mm+/- 1 mil | +/- 0.025 mm
Finished tolerance NPTH+/- 2 mil | +/- 0.05 mm+/- (2 mil | 0.05 mm) – /+ 0+/- 0.6 mil | +/- 0.015 mm
Epoxy filled through holes (Y/N)YesYesYes
Capped via (Y/N)YesYesYes
Maximum copper weight outerlayer5 Oz12 Oz> 12 Oz
Maximum copper weight innerlayer5 Oz12 Oz> 12 Oz
Control depth drill (Y/N)YesYesYes
Tolerance depth drill+/- 6 mil | +/- 0.15 mm+/- 4 mil | +/- 0.1 mm+/- 3 mil | +/- 0.075 mm
Backdrill diameter18 mil | 0.45 mm14 mil | 0.35 mm10 mil | 0.25 mm
Min. depth of backdrill10 mil | 0.25 mm8 mil | 0.2 mm6 mil | 0.15 mm
Drill depth tolerance+/- 6 mil | +/- 0.15 mm+/- 4 mil | +/- 0.1 mm< +/- 4 mil | +/- 0.1 mm
HDI type 1+n+1YesYesYes
HDI type 2+n+2YesYesYes
HDI type 3+n+3YesYesYes
HDI type 4+n+4YesYesYes
Min. laser hole diameter4 mil | 0.1 mm3 mil | 0.075 mm2.5 mil | 0.065 mm
Microvia Max.aspect ratio1:11:11:1
Copper filled microviaYesYesYes
Resin filled microviaYesYesYes
Stacked &Staggered via.YesYesYes
Laser via land pad size8 mil | 0.2 mm5 mil | 0.125 mm4 mil | 0.1 mm
Laser via capture pad size10 mil | 0.25 mm9 mil | 0.225 mm8 mil | 0.2 mm
IMS boardsYesYesYes
Embedded components (Y/N)NoYesYes
Soldermask via plugging IPC4761 type VI (Y/N)YesYesYes
Epoxy via plugging IPC4761 type VI(Y/N)YesYesYes
Epoxy via plugging IPC4761 type VII(Y/N)YesYesYes

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